Increasing thermal capability in Small signal MOSFETs

As designs get smaller there is an increasing demand for MOSFETs to have high power capabilities in smaller packages.  Reducing the size of components has a great impact on thermal management, as power dissipation must occur on smaller die sizes.  With the release of our DFN2020MD-6 MOSFET package we address both challenges, offering 15x higher thermal performance in a 47% space efficient solution.  Here we take a look at the evolution of small-signal MOSFET packages to gain a better understanding of thermal performance, focussing on simulation and measurement results.